2.5 & 3D Chip-to-board interconnect; Through-via interconnection with good coverage for trapezium or even reverse trapezium via; Through‑via interconnection for MEMS wafer‑level packaging; 3D integration of MEMS devices with Via Last approach for the formation of MEMS TSVs and Cu based thermo-compression bonding; CMOS chip; Integrated SiP; Precision dispensed die fillet; Fillets for electrical connections between different leveled surface; Multilayer circuitry; Microwave circuit; Drive circuit; Printed-sensor-on-chip device; Interdigitated electrode; Microwave & millimeter packaging; MEMS wafer‑level packaging; Semi-embedded power assembly; Electrical contacts in SOI MEMS; Liquid metal contact.
○Electronic Components: Microelectrode & microdevice; Ransistor; Capacitive strain gauge; Organic Electrochemical Transistors(OECTs); Thin-film transistors(TFTs); Selectively deposition of SWCNTs in TFT channels; Field effect transistor; Electrolyte-gated transistor; CNT transistor; Organic electrochemical transistor; PEDOT:PSS transistor; Thermistor (NiO, graphene channel); Dielectric line of touch panel display jumper; Flat inductor; Broadband inductor; Solid-core solenoid inductors; Ring oscillator; Microwave microstrip ring resonator; Electrochemical TEM microdevice; RGO circuit; Memristor; Notch filter; Bandpass filter; Actuator; RFID; Diode; Mie Resonator; Inverter; Quasi-Optical Terahertz components; CMOS inverters.
○ Flexible Electronics: Strain sensor; Humidity sensor; pH sensor; Flexible strain sensor; Flexible CNT transistors for pressure sensing; Flexible 1D−2D TFT; All-printed CNT TFT; Flexible SWCNT FE-TFTs; Flexible temperature sensor; Flexible CNT pH sensor; Paper photodetector; Freestanding structures for stretchable electronics and sensing application; Flexible CNT CMOS device; Smart devices on cellulose-based materials; Flexible and conductive graphene/Ag patterns.
○ Communication Antenna: Conformal antenna; Silver microstrip lines with ultralow RF signal loss; Alien squiggle antenna; Optical waveguides for short range communication; Coplanar waveguide; Band-stop filter; Magnetic nanocomposites for microwave circuit; Al/Cuo nanothermites for energetic antenna; Surface acoustic wave sensor; 3D metal-dielectric structures at sub-mm length scale; Sub-mm wavelength 3-D antenna; Planar inverted-F antenna (PIFA).
○ Sensors: Strain sensor; Humidity sensor; pH sensor; IoT sensor; Piezoelectric sensor; Capacitive touch sensor; Resistive temperature sensor; Cu−CuNi temperature sensor; Fluorescence quenching sensor; Image sensor; Bimodal sensor; Piezoresistive sensor; Microfluidic force sensor; Chemisensor; Immunosensor; Ammonia sensor; NO2 sensor; Electrochemical sensor; Electrochemical immunosensor; Electrochemical histamine sensor; Cells differentiation sensor; COVID-19 sensor; Prothrombin time sensor; Electrochemical amperometric ethylene sensor.
○ OLED: OLED with PEDOT : PSS grids; Polymer lines for organic LED; Sorting of semiconducting CNT and printed flexible driving circuit; Hybrid electronic circuits combining printed technology and surface-mount technology; Patterning of top emitting OLED; Thin-film encapsulation of organic layer.
○ LED: The die-attach material and the electrical interconnect; LED with printed die-attach, electrical interconnects and a phosphor layer; Phosphor layer precision deposition; Synthesis of highly luminescent phosphor spherical nanoparticles.
○ Optoelectronic Device: Optical waveguide; Top grids for organic optoelectronic device; Image sensor based on organic photodiodes; Epoxy resin for optical waveguide; Polymer optical waveguide; Epoxy resin on polycarbonate; Precise thickness deposition of PEDOT:PSS for modifying work function; Hierarchical pillar array electrodes for high-performance semi-artificial photosynthesis; Flexible semitransparent organic photodiodes (OPDs) in an inverted architecture without the use of ITO; Photoconductive ZnO films printed on flexible substrates; AJP process for the deposition of dielectrics and conductors for fully additive substrate integrated waveguide(SIW) with continuous sidewalls; Imbedded Graphene/ZnO bulk heterojunctions for ultraviolet photodetection; Printed black phosphorus ink for planar and conformal optoelectronics; MoS2/p-Si heterojunctions.
○ Optical Film: Rare earth luminescent thin film; Defect-tailored polymer-sorted SWNTs thin film; Graphene-embedded ZnO film; IGZO and ZnO film; Nanowire networks of ZnOEP.
○ Optical Devices: ZnO ultraviolet photodetector; Zinc octaethylporphyrin nanowire for flexible photodetectors; PEDPT:PSS photodetector; UV sensors of graphene quantum dot; Graphene/ZnO bulk heterojunction films for ultraviolet photodetection; Optical transmitter assembly of a microring modulator and a high-speed CMOS driver; Flexible semitransparent organic photodiodes (OPDs) in an inverted architecture without the use of ITO; Photoconductive ZnO films on flexible substrates; Printing polymer optical waveguides on conditioned transparent flexible foils.
○ Conductive Film: Transparent and freestanding SWCNT film; Transparent electrodeof silver nanowire and nanosheet; Conductive CNT/polyimide film; Flexible substrates with embedded silver line; High-conductivity crack-free 3D electrical interconnect directly printed on soft PDMS substrate; Highly conductive networks of silver nanosheets, SWNT membrane; Grid-type transparent electrode.
○ Brain-machine Interface: Customisable neuronal guidance; PEDOT:PSS pattern; High-aspect ratio micro-needle electrode array for human cerebral organoids; High-density microelectrode array platform with operation in penetrating into and recording from biological tissue; Multi‐dimensional OECT force sensor with high sensitivity and large measuring range
○ Electronic Skin: CNT complementary electronics and integrated sensor system; Hybrid printing of wearable piezoelectric sensor; Wearable bandage-based strain sensor for home healthcare; Soft, wireless periocular wearable electronics; Flexible tattoo electrodes for epidermal and in vivo electrophysiological recording; Skin-wearable sensor for monitoring of volumetric muscle loss; Potentiometric pH sensor for sweat measurements in smart patches.
○ Stent: Implantable vascular electronics with soft sensors for multiplex sensing of hemodynamics; Precise deposition of drugs in the grooves of the stent pillars to reduce shear damage during delivery.
○ Medical Devices: Multimaterial bathless stereolithography of hearing aid component; Highly efficient, homogeneous, and reproducible SERS structures.
○ Medical Sensors: Conformable and robust microfluidic force sensors to enable precision joint replacement surgery; Soft strain sensor for monitoring of structural health and human physiology; Graphene electrochemical immunosensors for rapid and label-free detection of SARS-CoV-2 in saliva; Structurally integrated 3D conductive networks-based flexible strain sensors for healthcare monitoring; Fine-featured triboelectric sensors for motion sensing; Graphene immunosensor for label-free cytokine monitoring in serum; Triboelectric sensor.
○ Flexible & Wearable: Soft, wireless periocular wearable electronics for mobile eye therapies; Wearable piezoelectric sensor; Wearable bandage-based strain sensor; Flexible strain sensor; Stretchable optoelectronic synaptic transistor array; Dielectric elastomer actuator; Freestanding conductive wires as stretchable interconnects/electrodes and as strain-sensors; Multilayer capacitive sensor by copatterning.
○ Cell & Protein: Flexible CNT pH sensor for live cell application; 3D electrochemical sensor for protein detection; Monitoring Caco-2 to enterocyte-like cells differentiation on printed sensor; Prothrombin time sensor for point-of-care testing; Biosensor; Ordered cell array; Printing fluorescence-marked protein and printing enzyme without affecting their biological activity; Aqueous gelatin; Printing biological reagents to fabricate in vitro diagnostic (IVD) assays.
○ Microfluidics: Conformable microfluidic force sensors; Rapid prototyping of microfluidic devices with versatile geometries and precise channel functionalization; Optofluidic chips for SERS; Support-material-free microfluidics on an electrochemical sensors platform; Produce bespoke molds for microfluidic devices; Selective wettability surface via AJP; Surface acoustic wave microfluidic devices.
○ Photovoltaics: Grid for ITO-free inverted organic solar cell; Cu2ZnSnS4(CZTS) thin film; Fine line printed silicon solar cell; Collecting electrode of photovoltaic device; Perovskite film; Low-cost metallization of silicon solar cell; Thin-film perovskite growth; Active layers in polymer solar cell(PCBTDPP:PC70BM, P3HT: PC60BM); Aluminum metallization of Si photovoltaic device; Laser chemical processing(LCP) and AJP to produce a high-efficiency front side for silicon solar cell.
○ New Energy Devices: Graphene & MXene microsupercapacitor(MSCs); Li-Ion battery cathodes(LFP cathode, hierarchically-porous); Silicon electrode; LiNi0.8Mn0.1Co0.1O2; YSZ electrolyte; Graphene electrode; Microlattice electrode; SOFC electrolyte and cathode layers; Top grids for organic optoelectronic device; LTO/CNT-based LIB; CoFe2O4-CNT 3D MSC devices; Lithium sulfide-carbon composite cathode; Mesoporous carbon sphere for potassium ion battery; Li-ion conducting solid polymer composite electrolytes; Silicon anode materials; Ultra-thin gel electrolyte based on polyvinyl alcohol-sodium chloride-glycerol; Carbon-based cathodes for metal-air batteries; Fibrous supercapacitor/LIB devices; Stretchable supercapacitors.
○ Micro/nanostructures: Curling and alignment of MXene; Crumpled MXene nanosphere; 3D Networks of Ag nanorod–nanoparticle hybrids; Hybrid MXene/C nanospheres; Pomegranate-like Y2O3:Eu; CTZS thin film; CoFe2O4 nanoparticles; Porous noble metals and alloys; Cu@Ag core-shell structures; TiO2–x/C composite microspheres.
○ Gradient Materials: Graded SOFC anode interlayer; Copatterning of PDMS and graphene platelet; Compositionally graded organic–inorganic nanocomposites; High-throughput printing materials with compositional gradients at microscale spatial resolution; Multimaterial bathless tereolithography; PI/CNT nanocomposite with tailorable and controllable intra-part varying CNT loading.
○ Metamaterials: Terahertz metamaterial with precise deposition of metallic inks with line widths down to 10µm and the use of digitally generated tool paths; Metamaterial-inspired terahertz filter.
○ Thermo- & Piezoelectric: PZT thick films; Flexible thermoelectric film; Wearable piezoelectric sensor; Flexible thermoelectrics with ultrahigh power factor; Flexible bismuth telluride and antimony telluride thin films; Sb2Te3 nanoflakes/MWCNTs nanocomposites.
○ Aerospace: Space survivability for printed electronics applications; Embedded polymer based piezoresistive sensors; Al/Cuo nanothermite; CNT transistors for pressure sensing in automobile tire; Strain gauge on aluminum substrate; Radiation-hardened field-effect transistor; Dielectric ceramic layers.
○ Radiation Detection: Pt contact on 4H-SiC for radiation detection; Ni nanoparticle thin film on nickel substrate; Graphene composite film-based UV sensor.
○ Food Safety: Graphene electrochemical histamine sensors for food safety monitoring; Biodegradable materials; Metal nanocluster-modified CNT electrode for electrochemical sensing detection of carbendazim.
○ Anti-counterfeiting: Security printing of covert quick response code using upconverting nanoparticle inks; RGB additive-color printing system by independent deposition of three primary-color upconverting inks.
○ Gases & Chemical Detection: Fluorescence quenching sensor arrays for the identification and auantification of explosive vapors; Chemisensor for the detection of nerve gas; Sensor for detecting chemical species; Nanoparticle based sensors on paper for detecting chemical species; Hydrogen sensor with platinum-decorated SWCNTs; Electrochemical NO2 sensor based on ionic liquid; Platinum microheaters for the application in gas sensors; WS2 nanosheets-based ammonia gas sensor; Ionic liquid-based flexible hydrogen sensor; Polyaniline-based ammonia sensor.
○ Micro/nano Fabrication: Sugar microlattice; PEDOT:PSS and CNT needle arrays; Ag microcone/needle/pillar array; Ag microlattice; Hierarchical ITO pillar array electrodes; Collagen pillar array; Ag leaf- or flflake-like structures; Collagen lattice unit; Complex 3D microengineered materials by pointwise spatial printing; Arrays of metal nanostructures with fexible geometry and feature sizes via charged aerosol jets.
○ Structural Health Monitoring: Buckypaper multifunctional sensors for composite structural health monitoring; Noninvasive material thickness detection by AJP of sensors; Capacitive strain gauge for soft structural materials; Strain gauge printed onto a layer of H-cement; Strain gauge on low-melting point plastic surface.
○ Microheater: Au double meander micro-hotplate; Platinum microheater on LTTC ceramic substrate; Resistance temperature detector‐micro hotplate with temperature coefficient of resistance stabilized.
○ Fire Detection: Smell detecting electronic nose (e-Nose) of SnO2 nanowires.
○ Membrane Reactor: Palladium-silver alloys.
Aerosol Jet Printing Products
Suzhou Headquarter
19th Floor, Building B, 388 Ruoshui Road, Suzhuo Industrial Park (SIP), Suzhou, Jiangsu Province, CHINA
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